http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201720261-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2016-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bde6c4677ade57d6a6b6e34ed1356ec0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afedfb0eb8fc74f0766aed889a920689
publicationDate 2017-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201720261-A
titleOfInvention Printed wiring board manufacturing method
abstract The present invention provides a method of manufacturing a printed wiring board, which can meaningfully prevent an intrusion of a chemical solution into an interface between a carrier and an extremely thin copper layer in a step of forming a build-up wiring layer, and can meaningfully suppress a coreless support Partial cracking of the very thin copper layer in the separation step and the resulting defects. The method of the present invention comprises the steps of: preparing a carrier copper foil with a product Wc × Pc of a product width Wc × Pc of 20 to 50 μm in the surface of the release layer side of the carrier; Or forming a build-up wiring layer on the ultra-thin copper layer to form a build-up layer with the build-up wiring layer, and separating the build-up layer of the build-up wiring layer on the peeling layer to obtain a multilayer wiring board including the build-up wiring layer The step of processing the printed wiring board by processing the multilayer wiring layer.
priorityDate 2015-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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