abstract |
An object of the present invention is to provide a thermosetting resin composition for electric and electronic industries which is excellent in fluidity, moisture resistance reliability, and adhesion at high temperatures, which is suitable for underfilling and potting operations. The solution of the present invention is a thermosetting resin composition comprising (A) a thermosetting resin and (B) a bismaleimide compound which is liquid at 25 ° C, and is described in JIS Z8803:2011 The viscosity at 25 ° C measured by the method is in the range of 1 mPa ‧ to 850 Pa ‧ . |