| titleOfInvention |
Underlayer film forming material for compound, resin, lithography, composition for forming underlayer film for lithography, underlayer film for lithography, method for forming resist pattern, circuit pattern forming method, and purification method |
| abstract |
A compound or a resin represented by the following formula (1). □ (In the formula (1), X is independent of each other, and represents an oxygen atom, a sulfur atom or no cross-linking, and R1 is independent of each other, and is derived from a halogen group, a cyano group, a nitro group, an amine group, a hydroxyl group, a thiol group, or a heterocyclic group. And an alkyl group having 1 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, an aryl group having 6 to 40 carbon atoms, and a combination of the combinations thereof, wherein the alkyl group, The alkenyl group and the aryl group may also contain an ether bond, a ketone bond or an ester bond, and each R2 is independently, and is an alkyl group having 1 to 30 carbon atoms, an aryl group having 6 to 40 carbon atoms, and an alkenyl group having 2 to 30 carbon atoms. a thiol group or a hydroxyl group, wherein at least one of R2 is a group having a hydroxyl group or a thiol group, and m each independently is an integer of 0 to 7 (here, at least one of m is an integer of 1 to 7), p Each is independently 0 or 1, q is an integer from 0 to 2, and n is 1 or 2). |