| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate |
2016-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a42897b840c1ee9cad057d72ce27e5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fe6d9e510de5f689eb718dd9f18edf8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edddcf3b24dea357927e15c453f7c782
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5de29f7bfa92ad73c79bb2e5a4a40220
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e681ed20fe103e00b76a5f607f6ea06b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4d9ded9699682ef49f7ba84379b8d07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4aa56b87c0bb27d1551ab9fe14bfad3e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c4bf4342183d4ddf340daf7d7a42dd6 |
| publicationDate |
2017-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201714818-A |
| titleOfInvention |
MEMS package and method of forming same |
| abstract |
The MEMS package includes a complementary metal oxide semiconductor substrate, a MEMS substrate, and one or more conductive polysilicon vias. The complementary metal oxide semiconductor substrate has one or more semiconductor elements disposed in the semiconductor body. The MEMS substrate has a dynamic component, wherein the MEMS substrate is connected to the complementary MOS substrate by a conductive connection structure disposed on the front side of the MEMS substrate and located in the lateral direction of the self-dynamic component The location of the offset. One or more conductive polysilicon vias extend through the MEMS substrate to the conductive connection structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I796659-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11655146-B2 |
| priorityDate |
2015-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |