| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate |
2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f66b350036a3aaa24bf8610b4554d46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84c8d19fadc69d02a236bc632a932869
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44f8d5e6da6934a1fbfbe2241413b72b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edc8c64e26f6ee47fe54705f4a9522b4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1db1670c8ef8428476b02faf64d87ab |
| publicationDate |
2017-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201714187-A |
| titleOfInvention |
Connecting structure and electronic parts |
| abstract |
An object of the present invention is to provide a conductive connecting structure which is excellent in voltage resistance while maintaining conductivity, and an electronic component having the connecting structure.nAs a solution, the splicing structure or the like of the present invention is characterized in that the member having the first electrode and the member having the second electrode are electrically connected by the conductive substance containing the conductive particles in the adhesive layer. The connection structure of the anisotropic conductivity, the adhesive layer containing the conductive particles at a concentration of 0.01 to 4.0% by volume, and the film thickness of the adhesive layer at the electrical connection between the first electrode and the second electrode is not full The conductive particles have a maximum particle diameter of one-half, and the thickness of the adhesive layer at the non-electrical connection is equal to or larger than the maximum particle diameter of the conductive particles. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11447666-B2 |
| priorityDate |
2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |