http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201709568-A

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filingDate 2016-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71d79fda426daf7714a387956207fcf1
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publicationDate 2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201709568-A
titleOfInvention Manufacture of light-emitting diodes using high refractive index adhesives
abstract The present invention discloses a system for the manufacture of a light emitting diode assembly. The solution to the problem of effective use of high refractive index adhesives depends on non-suppressive curing in order to achieve a non-contaminant and debris-free adhesion between the surfaces. The device is designed and fabricated such that the surfaces to be joined together are initially treated in a manner that promotes the use of a high refractive index adhesive. A multi-step process involving two different concentrations of a catalyst is performed to produce a highly reliable, non-browning and non-broken LED when using a high refractive index adhesive.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111164769-B
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priorityDate 2015-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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