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filingDate 2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab743417a5bf059dc466faea9cdf9d69
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publicationDate 2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201709331-A
titleOfInvention Substrate processing method and substrate processing device
abstract A substrate processing apparatus (10) according to the present invention includes: a housing portion (11) for housing a substrate (S); a gas supply portion (13) for supplying a gas for generating plasma; and generating electricity from a gas for generating plasma The slurry is supplied to the plasma supply unit (12) of the accommodating portion (11). The gas for generating the plasma contains at least one of a nitrogen atom and an oxygen atom. The gas supply unit (13) supplies the gas for generating the plasma to the plasma supply unit (12) so that the ratio of the flow rate of the additive gas to the flow rate of the hydrogen gas is 1/500 or more.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I713133-B
priorityDate 2015-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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