| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f0f795b474ba632e49277e4cbe793b5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49555 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-208 |
| filingDate |
2016-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd8558c12beb39db62077d7d55546cb2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d692041f1dea1bc7f3e02a9c6e029d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6863c56db44da95813ce7ccd1879ad52 |
| publicationDate |
2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201709309-A |
| titleOfInvention |
Semiconductor device and method of manufacturing same |
| abstract |
A predetermined thickness portion of the total thickness of the tie bars of the lead frame (2) of the QFN substrate (1) is cut using a rotary blade (21) thicker than a conventional rotary blade (24) to form a cutting groove (22). Next, a plating layer (23) is formed on the bottom surface of the lead frame (2) and the surface of the dicing trench (22) by electroplating. Next, the residual thickness portion of the lead frame (2) in the dicing groove (22) and the entire thickness of the encapsulating resin (8) are cut together using a rotating blade (24) of a usual thickness. The QFN article (26) is manufactured by dividing the QFN substrate (1) into two stages to completely remove the tie bars. In the QFN product (26), a plating layer (23) can be formed stably on the side surface of the lead (5) and on the surface of the concave portion (27) formed on the side surface of the lead (5). |
| priorityDate |
2015-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |