http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201707526-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2016-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f67ed0d10eca23970047a24da8c46d2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c542f37dd7b0d7bfe0c7fdac3e68833b |
| publicationDate | 2017-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201707526-A |
| titleOfInvention | Sealing resin sheet for substrate with built-in electronic parts and method for manufacturing substrate with built-in electronic parts |
| abstract | The present invention provides a sealing resin sheet for a substrate of a built-in electronic component which is easy to control the linear expansion coefficient and which can suppress the occurrence of voids during production. The present invention relates to a sealing resin sheet for a substrate having a built-in electronic component, which has a single layer structure having a thickness of 150 μm or more and 1000 μm or less, and has a linear expansion coefficient of 10 ppm/K or more after heat treatment at 150 ° C for 1 hour. And below 28ppm/K. The sealing resin sheet for a substrate on which the electronic component is built preferably contains an inorganic filler having an average particle diameter of 0.5 μm to 5 μm, and the content of the inorganic filler is 70 to 87% by weight. |
| priorityDate | 2015-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.