| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06503
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-09517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05547
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80194
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0616 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14634
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-535 |
| filingDate |
2012-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6634e62743e61306c70026ef8cb4f374
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c37f091fb22c8d5e548ab2e54c4d8fb5 |
| publicationDate |
2017-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201707180-A |
| titleOfInvention |
Semiconductor imaging device |
| abstract |
The present invention provides a semiconductor device having a more reliable bonding surface. The first semiconductor device includes: a first interconnect layer including: a first interlayer insulating film; and a first surface buried in the first interlayer insulating film and having a surface on the same surface as one surface of the first interlayer insulating film An electrode pad; and a first dummy electrode embedded in the first interlayer insulating film and having a surface on the same surface as one surface of the first interlayer insulating film and disposed around the first electrode pad; and the second The wiring layer includes: a second interlayer insulating film located on one surface side of the first electrode pad of the first interlayer insulating film; and a first interlayer insulating film embedded in the second interlayer insulating film and having a surface and a second interlayer insulating film a surface on the side of the interlayer insulating film is located on the same surface, and is bonded to the second electrode pad on the first electrode pad; and a surface is disposed on the same surface as the surface on the side of the first interlayer insulating film of the second interlayer insulating film, and is disposed on the same surface The second electrode pad is bonded to the second dummy electrode on the first dummy electrode. The second semiconductor device includes a first semiconductor portion having a first electrode extending on the surface on the bonding interface side and extending in the first direction, and a second semiconductor portion having the first electrode bonded to the first electrode The second electrode extending in the second direction intersecting the first direction is provided to be bonded to the first semiconductor portion at the bonding interface. |
| priorityDate |
2011-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |