| abstract |
In the present invention, a light-emitting device is manufactured by bonding the LED elements 52 via the anisotropic conductive adhesive 50 on the wiring substrate 51. In the manufacturing process, the anisotropic conductive adhesive 50 is disposed on the wiring substrate 51, and the LED element 52 is disposed on the anisotropic conductive adhesive 50. The anisotropic conductive adhesive 50 contains a polymerizable epoxy-modified polysiloxane resin and a metal chelate compound, and when the LED element 52 is pressed by the pressurizing body 53, the wiring substrate 51 is maintained at 160 ° C or higher. The temperature is 210 ° C or lower, and the pressurizing body 53 is set to be lower than the temperature of the wiring substrate 51, and only a specific pressing time is pressed. Since the epoxy-modified polyfluorene-based resin and the metal chelate compound are reacted at a low temperature, the LED element 52 can be temporarily connected to the wiring substrate 51 without causing the phosphor layer to be cracked. |