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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-511
filingDate 2015-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97ff2337516ebd0bbbcf73fba0fb8362
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publicationDate 2017-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201703276-A
titleOfInvention Ultra-shallow junction photovoltaic cell manufacturing method
abstract The invention relates to a method for manufacturing a photovoltaic cell with ultra-shallow junction layer, wherein the manufacturing process comprises the step of cleaning the crystalline germanium substrate by electron cyclotron resonance high-density plasma method, and the temperature of the crystalline germanium substrate is 50 ° C to 250 ° C, The microwave power is about 500W, the deposition pressure is below 50mTorr, the flow rate of argon gas, hydrogen gas is about 20sccm, the flow rate of SiH4 is about 1-2sccm, and the flow rate of 2% diborane is about 5~15sccm. The growth thickness is 5~80nm. The first doped semiconductor layer having a band gap of about 1.12 eV has the advantages of a steep homogenous epitaxial junction, an ultrathin, high crystallinity ruthenium-based film, high doping concentration, high electrical conductivity, and high short-circuit current. Therefore, the efficiency of the product can be improved.
priorityDate 2015-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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