| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3492
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-1539
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3492
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-08 |
| filingDate |
2016-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb7d98261fefee9db54ed9bce19d6e12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ffde6a1d4e07d81674ca128c23e5393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_946f5ff45d52d73074fd6c0d121cd2ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a613aaa12ae0a1b983570a3a60df9305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccbc07d8b9e849ad63c8f7d9e7f8cb76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50b0dad22acb5b4f946ae89c8ba6ef11 |
| publicationDate |
2017-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201702298-A |
| titleOfInvention |
A thermosetting resin composition containing a polyol compound, an acid anhydride compound, and a thermosetting resin, a polyvalent carboxylic acid resin, a thermosetting resin composition using the same, and any of the above thermosetting resin compositions. Optical semiconductor device as a sealing material or a reflective material |
| abstract |
The present invention provides a thermosetting resin composition containing a polyol compound (A) having three or more hydroxyl groups, an acid anhydride compound (B), and a thermosetting resin (C); and a thermosetting resin composition Is characterized in that it contains a polycarboxylic acid (A1) represented by the following formula (1), and the ICI cone and plate viscosity is in the range of 0.01 to ‧ 10 Pa s in the range of 100 to 200 ° C; and a semiconductor device is provided Any of the above thermosetting resin compositions is used as a sealing material or a reflective material.n□ (In the formula (1), R1 represents an alkylene group having 1 to 6 carbon atoms, and R2 represents a hydrogen atom or an alkyl group or a carboxyl group having 1 to 6 carbon atoms. In the formula (1), a plurality of R1, R2 may be the same or different) |
| priorityDate |
2015-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |