http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201701331-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32137
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-335
filingDate 2016-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d04be56a9d142d17374c31321a508079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a64be52af17d74df8809ff1fd82d6f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82a2df81e16a643fbecf8e238aa39cf5
publicationDate 2017-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201701331-A
titleOfInvention Gate electrode material residue removal process
abstract The present invention provides a method of removing gate electrode residues from a gate structure after a gate electrode patterning process. In one example, a method for forming a high aspect ratio feature in a gate electrode layer of a gate structure includes performing a surface treatment process on a gate electrode residue remaining on the gate structure, the gate structure setting On the substrate; selectively forming a processed residue in the gate structure on the substrate, and having some untreated regions in the vicinity of the gate structure; and performing a remote plasma residue removal process to remove from the substrate The residue is treated.
priorityDate 2015-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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