| abstract |
Disclosed herein is a granular epoxy resin composition for packaging a semiconductor device, a method of packaging a semiconductor device, and a semiconductor device packaged with the particulate epoxy resin composition. The particulate epoxy resin composition has an average particle size of from about 500 microns to about 1200 microns, and the average particle size is introduced into the shaker at 200 grams of the epoxy resin composition, followed by 80 revolutions/ After 10 minutes of classification in minutes, as calculated by Equation 1, the opening sizes in the shaker are 150 microns, 250 microns, 355 microns, 500 microns, 600 microns, 850 microns, 1000 microns, 1700 microns, and 2000. The micron sieves are stacked in this stated order. |