| abstract |
By the following resin composition, a resin composition which can be applied as a photoresist which can be peeled off after the process treatment and which can maintain high resolution and pattern shape even after high-temperature process treatment, characteristics of the resin composition In the case of (A1) an alkali-soluble resin having a specific structural unit, (A2) is selected from the group consisting of a polyimine, a polybenzoxazole, and a polyamidoxime which have a substituent reactive with a reactive group of the alkali-soluble resin. One or more resins of the group consisting of the imine, the precursor and the copolymer, and (B) the sensitizer, the resin of (A2) is (100%) based on 100 parts by weight of the resin (A1) 310 parts by weight to 2000 parts by weight. |