Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8abb210936dc3b56af93e346a2335b7f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0158 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-08 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 |
filingDate |
2016-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51b040a0ebad7709ad3a840db588f6ef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02d509e3035c900560fc2760cc466420 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6b6ab5ecad765ad4cd80eccec4840cb |
publicationDate |
2016-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201643172-A |
titleOfInvention |
Preparation of highly conductive copper film |
abstract |
The present invention is a copper precursor composition comprising: a first copper complex of an imine or a first cyclic amine coordinated to a first copper precursor compound; and a primary amine coordinated to a second copper precursor compound Or a second copper complex of a second cyclic amine. The copper precursor composition comprises a copper complex coordinated to the imine of the copper precursor compound. The copper precursor composition can be thermally degraded at a lower temperature than the comparable composition comprising only the primary amine copper complex under the same conditions to produce a metal having a resistance of about 200 micro ohms or less. Copper film. An ink containing a copper precursor composition and a solvent may be deposited on a substrate and sintered to produce a metallic copper film. The substrate having the film thereon can be used for an electronic device. |
priorityDate |
2015-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |