patent/TW-201642414-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201642414-A

Outgoing Links

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assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0454b8157065aa79e639d913ec748f6b
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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
filingDate	2016-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8c4e611fbed952d3ceba8195ac82075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb9d54ca142583fa94977ad75f099ec6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5958593753a15e798ec7ffb76dff9d5
publicationDate	2016-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-201642414-A
titleOfInvention	Semiconductor package and method of manufacturing same
abstract	Semiconductor packages and methods of fabricating semiconductor packages are disclosed. As a non-limiting example, various aspects of the present disclosure provide various semiconductor packages and various methods of fabricating semiconductor packages that include a conductor layer that includes an anchor portion that extends through at least one dielectric layer.
priorityDate	2015-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667

Total number of triples: 55.