| abstract |
The invention provides thermal curing at a temperature of about 80 ° C, excellent PCT resistance and long shelf life, so that it can be preferably used as a liquid type adhesive for the manufacture of an image sensor module or an electronic component. Things. The resin composition of the present invention is characterized by comprising (A) a compound represented by the following formula (1), an oligomer represented by the following formula (2) as a basic skeleton, (C) an epoxy resin, and (D) The resin composition of the hardening accelerator, wherein the mass ratio of the compound of the component (A) to the oligomer of the component (B) ((B)/(A)) is 5 to 25%, and the compound of the component (A) The thiol equivalent ratio of the compound of the component (A) to the oligomer of the component (B) is 0.5 in terms of the total amount of the oligomer of the component (B) with respect to the epoxy equivalent of the component (C). The equivalent amount is 2.5 equivalents, and the chloride ion concentration in the resin composition is 230 ppm or less.n□ □ |