http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201640964-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2015-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d87d7b9ad64f60e219422dda68a53b90 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7e4e1500d7d0e6579c402d418cf0851 |
| publicationDate | 2016-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201640964-A |
| titleOfInvention | High-frequency signal transmission circuit forming surface-treated copper foil, high-frequency signal transmission printed circuit board manufacturing copper-clad laminate and high-frequency signal transmission printed circuit board |
| abstract | The present invention provides a skin effect that does not exhibit a roughening treatment layer when a high-frequency signal transmission can be formed, and is intended to obtain a surface-treated copper foil of a roughened layer of a circuit according to a designed signal transmission speed. In order to achieve the object, a surface-treated copper foil or the like for forming a high-frequency signal transmission circuit is used, which is characterized in that it is a surface-treated copper foil having a roughened layer on the surface of a copper foil, and the roughened layer is The copper composite compound containing copper oxide and cuprous oxide is composed of fine needle-like or plate-like irregularities, and the copper layer has an average crystal grain size of 2.5 μm or more when the copper foil is observed in a cross section. |
| priorityDate | 2014-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.