Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2500-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-016 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F36-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4276 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
filingDate |
2015-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10bc51e54cc0b555cb3f0d213458f3e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ee46291062055ff421f8162ff5a5538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_178913e64e7da62e581afa78a19906cb |
publicationDate |
2016-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201639921-A |
titleOfInvention |
Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and manufacturing method thereof |
abstract |
The present invention is a thermosetting resin composition comprising a polyamidene compound (A), a modified polybutadiene (B), and an inorganic filler (C) having a source The structural unit derived from the maleimide compound (a1) and the structural unit derived from the diamine compound (a2) having at least two N-substituted maleimine groups. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I725558-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11315804-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I783097-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11310910-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I665254-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I732267-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I749632-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I770330-B |
priorityDate |
2015-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |