| abstract |
The invention discloses a wafer module comprising a wafer having an upper surface, a lower surface and a side wall. The wafer includes a signal pad region adjacent to the upper surface. A recess extends from the upper surface toward the lower surface along the sidewall of the wafer. A wiring layer is electrically connected to the signal pad region and extends into the recess. A circuit board is located between the upper surface and the lower surface of the wafer and extends into the recess. A conductive structure is located within the recess and electrically connects the circuit board to the redistribution layer. The invention also discloses a method of manufacturing a wafer module. |