http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201637095-A

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32091
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filingDate 2015-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3762cae68b4af4cc0d27ee99aa40c9d5
publicationDate 2016-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201637095-A
titleOfInvention Plasma assisted atomic layer etching method
abstract The invention discloses a method for etching a film on a substrate, comprising at least one etching cycle, wherein an etching cycle comprises: continuously supplying an inert gas into the reaction space; and supplying a pulse of etching gas to the reaction a continuous inert gas stream upstream of the space to chemically adsorb an unexcited etching gas on the surface of the substrate; and provide a pulse of RF power discharge between the electrodes to generate the inert gas in the reaction space Reactive species to etch the film layer on the substrate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I692797-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11004665-B2
priorityDate 2015-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.