| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76829
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0234 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-52 |
| filingDate |
2016-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c831012e04718c6061bda227998fc2a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05c7d84b0da7af8fbaf9d6d2acf8da80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17dc079e9764176b8f0546e7fcaa10bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7bc801fd112f0b7d900e1741e803319
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78e08906f4cf6a1a02c756f43948f2c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2245c87837d400259992de4164c047b0 |
| publicationDate |
2016-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201636453-A |
| titleOfInvention |
Pulsed plasma for membrane deposition |
| abstract |
A method of processing a substrate is provided in the present case. In some embodiments, a method of processing a substrate disposed in a processing chamber includes: (a) depositing a layer of material on a substrate by exposing the substrate to a first reactive species, the first reactive species utilizing a distal end Producing a plasma source; and (b) treating all or substantially all of the layer of deposited material by exposing the substrate to a plasma, the plasma being produced in the processing chamber using a second plasma source; wherein the remote plasma At least one of the source or the second plasma source is pulsed to control the deposition cycle and the processing cycle. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I728478-B |
| priorityDate |
2015-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |