| abstract |
An object of the present invention is to provide a composition for forming a photoresist film for a lithography for use as a resist film underlayer film as a hard mask.nThe solution is a lithographic photoresist underlayer film forming composition comprising hydrolyzable decane, a hydrolyzate thereof, a hydrolysis condensate thereof, or a combination thereof as a decane, and the hydrolyzable decane is selected from the group consisting of And at least one hydrolyzable decane group of the hydrolyzable decane represented by the formula (2) and the formula (3). A method of manufacturing a semiconductor device, comprising: a step of forming an organic underlayer film on a semiconductor substrate; a step of applying a photoresist underlayer film forming composition to form a photoresist underlayer film; and forming the photoresist a step of forming a photoresist film on the underlayer film to form a photoresist film, a step of developing and exposing the photoresist film to obtain a photoresist pattern, and performing etching in sequence.n□ |