| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-36 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 |
| filingDate |
2015-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_961108b179fb346d8896826a38ede178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_909862ef6aaa5ce31a9e9699b18fdfaa |
| publicationDate |
2016-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201633874-A |
| titleOfInvention |
Multilayer wiring substrate |
| abstract |
The present invention provides a multilayer wiring board which can achieve excellent conduction reliability. The multilayer wiring board is formed by laminating an anisotropic conductive member and a wiring board having a substrate and one or more electrodes formed on the substrate, and the anisotropic conductive member includes an insulating substrate including an inorganic material. a plurality of conductive paths including a conductive member are provided in a state of being penetrated and insulated from each other in a thickness direction of the insulating base material; and an adhesive layer is provided on a surface of the insulating base material, and each of the conductive paths includes self-insulating The protruding portion of the surface of the substrate is protruded, and of the plurality of conductive paths, the conductive path in contact with the electrode is deformed, and the adjacent conductive paths are in contact with each other. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I723250-B |
| priorityDate |
2014-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |