| abstract |
The present invention describes an organic-inorganic hybrid structure for an integrated circuit package. In one example, an integrated circuit package includes a ceramic frame, an integrated circuit die, and a redistribution layer. The ceramic frame has a top side and a bottom side, the top side having a sash having a bottom plate and a plurality of conductive perforations in the bottom plate. The integrated circuit die is attached to the backplane and over the conductive vias. The redistribution layer is on the bottom side and is connected to the electrically conductive perforations. |