http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201632332-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-62 |
filingDate | 2015-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2be46d0c1b1c3ab5867c854bd45587d4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d7d7b588381640787bf3b64035a0f07 |
publicationDate | 2016-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-201632332-A |
titleOfInvention | Release film and method of manufacturing semiconductor package |
abstract | The present invention provides a release film which has excellent antistatic action and high transparency in a high temperature environment, and a method of producing a semiconductor package using the release film.nA release film is disposed on a surface of a mold that is in contact with a curable resin when a semiconductor element is placed in a mold and sealed with a curable resin to form a resin sealing portion to manufacture a semiconductor package; The film includes a release substrate that is in contact with the curable resin when the resin sealing portion is formed (except that no antistatic agent is contained), and an antistatic layer that is in contact with the mold when the resin sealing portion is formed; an antistatic layer At least one antistatic agent selected from the group consisting of a conductive polymer and a conductive metal oxide is contained, and the total light transmittance of the release film is 80% or more. |
priorityDate | 2014-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.