http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201632332-A

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filingDate 2015-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2be46d0c1b1c3ab5867c854bd45587d4
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publicationDate 2016-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201632332-A
titleOfInvention Release film and method of manufacturing semiconductor package
abstract The present invention provides a release film which has excellent antistatic action and high transparency in a high temperature environment, and a method of producing a semiconductor package using the release film.nA release film is disposed on a surface of a mold that is in contact with a curable resin when a semiconductor element is placed in a mold and sealed with a curable resin to form a resin sealing portion to manufacture a semiconductor package; The film includes a release substrate that is in contact with the curable resin when the resin sealing portion is formed (except that no antistatic agent is contained), and an antistatic layer that is in contact with the mold when the resin sealing portion is formed; an antistatic layer At least one antistatic agent selected from the group consisting of a conductive polymer and a conductive metal oxide is contained, and the total light transmittance of the release film is 80% or more.
priorityDate 2014-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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