| abstract |
The present invention provides a lithographic process underlayer film formation which is excellent in planarization performance on a step substrate and has good landfill performance for a microporous pattern, and thus has a wafer surface which is flattened after film formation. Composition.nA photoresist underlayer film forming composition comprising a polymer and a solvent, the polymer comprising the following formula (1):n□n(In the formula (1), R1 to R4 each independently represent a hydrogen atom or a methyl group, and X1 represents a divalent organic group which may be substituted with an alkyl group, an amine group or a hydroxyl group and contains at least one exoaryl group) Unit structure; X1 system (2) in equation (1):n□n[In the formula (2), A1 represents a phenyl or anthracene group, and A2 represents a phenyl group, a naphthyl group, or a formula (3):n□n(In the formula (3), A3 and A4 each independently represent a phenyl or anthracene group, and the dotted line represents an organic group represented by a bond, and the dotted line represents an organic group represented by a bond]. |