| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b051f9f7933c758e66f6ceda5c9fb2cc |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B44C1-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B29-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2016-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb94c09959703cd74d606bd26edbbea9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_baefb23525d82c5685b57160b9cdee30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_646a296935e70e6d967f4effba5bb71d |
| publicationDate |
2016-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201631112-A |
| titleOfInvention |
Tungsten chemical mechanical honing reduces shallow disk effect |
| abstract |
This invention relates to slurries, methods and systems that can be used in chemical mechanical planarization (CMP) of tungsten-containing semiconductor devices. Additives are used to reduce the shallow disk effect on large and small feature sizes (large bond pads and fine line structures) without reducing the tungsten removal rate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I747352-B |
| priorityDate |
2015-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |