| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2309-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68304 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2015-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e63d8344f3180bf354de012373aa4ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92e39595b9abb1cf6e0d00834a128593
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cd211457d06b5eb48ba77b9d06b22f7 |
| publicationDate |
2016-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201631077-A |
| titleOfInvention |
Support body, adhesive sheet, laminated structure, semiconductor device, and manufacturing method of printed circuit board |
| abstract |
The present invention provides a method of manufacturing a printed circuit board which does not reduce the yield even if the resin composition layer is thermally cured to form an insulating layer in a state in which a support is attached. The manufacturing method of the printed circuit board comprises the steps of: (A) a layer comprising a support body and a resin composition layer bonded to the support body to bond the resin composition layer and the inner layer substrate a step of combining the inner substrate, and a step (B) of thermally curing the resin composition layer to form an insulating layer, and a step (C) of removing the support; and the support is heated under a predetermined heating condition Satisfy: the maximum expansion ratio EMD (%) in the MD direction when the condition (MD1) is above 120 °C is less than 0.2%, and the maximum expansion ratio ETD (%) in the TD direction when the condition (TD1) is above 120 °C is not reached. 0.2%. |
| priorityDate |
2014-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |