| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-858
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 |
| filingDate |
2015-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6fd396982571291ceb4307e5518a538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b60a7bbd8a53df9b805291155fe4437
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45f3e75392730f01a4d41db42f018fa2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a12b3e1ed4253e7bb6782495c9bbde47 |
| publicationDate |
2016-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201631076-A |
| titleOfInvention |
Substrate, subsequent sheet with dicing sheet, laminated sheet, and method of manufacturing semiconductor device |
| abstract |
An object of the present invention is to provide a subsequent sheet or the like which can reduce vibration of a semiconductor wafer and can reduce wafer breakage and bonding failure between a bonding wire and a pad. The present invention relates to a continuous sheet having a tensile modulus of elasticity of 1 MPa to 20 MPa at 130 ° C and a tan δ of 0.1 to 0.3 at 130 ° C. |
| priorityDate |
2014-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |