| abstract |
The solution is a polyfluorene oxide resin having a structural unit of (1) and having a weight average molecular weight of 3,000 to 500,000, which comprises a polyfluorene oxide resin having a polypyrene content of 10 to 40% by mass (A-1). And a polyxanthene resin (A-2) having a polyoxonium content of 50 to 80% by mass, and a mass content of the polyoxyxylene resin (A-1) in the total mass of the polyoxyxylene resin is 10 to 50 masses. %;n□n(a, b are positive numbers, a+b=1, X is a divalent linking group of (2) or (2) and (3), and the number of moles of the unit shown in (2) is c, (3) When the number of moles of the unit shown is d, c:d is 0 when the c is 1 and is d≦0≦d≦1)nThe effect of the invention is that the invention can be processed into a film shape, and has good moldability for a large diameter or thin film wafer, excellent adhesion, low warpage, and excellent wafer protection, and the wafer can be integrally formed Molding, which can be applied to resin films in wafer level packaging. |