| abstract |
Provided is a release film which is excellent in mold release property and which can reduce mold contamination in a sealing step, a method for producing the same, and a method for producing a semiconductor package using the above-described release film.nThe release film is disposed in a mold in which a semiconductor element is placed in a mold and sealed with a curable resin to form a resin sealing portion, and is disposed on a surface of the mold that is in contact with the curable resin; the release film is provided with a resin a side release layer and a gas barrier layer, wherein the resin side release layer is in contact with the curable resin when the resin sealing portion is formed; the gas barrier layer contains the polymer (I), and the polymer (I) is selected from At least one of the group consisting of a polymer having a vinyl alcohol unit and a polymer having a vinylene chloride unit, and the gas barrier layer has a thickness of 0.1 to 5 μm. |