| abstract |
The present invention is an epoxy resin composition comprising (A) an epoxy resin, (B) a resin having an aromatic ring and a hydroxyl group, and (C) an inorganic filler; wherein the (A) epoxy resin is contained in 25° C. is a liquid epoxy resin; (B) a resin having an aromatic ring and a hydroxyl group, and a resin having a naphthalene ring and a hydroxyl group; and the content of the epoxy resin which is liquid at 25° C., as described above ( A) The epoxy resin and the total amount of the resin having an aromatic ring and a hydroxyl group (B) are 30% by mass or more based on the total amount. |