| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f71ddd387b22b19ebcea454e62d66128 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 |
| filingDate |
2015-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f53ed50785449766dc7fd5912e49e90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1052f6e9338cffba0efb4c5543dfda0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c961ced8d1250c67321183e42fe50d6 |
| publicationDate |
2016-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201629135-A |
| titleOfInvention |
Resin composition and flux |
| abstract |
An object of the present invention is to provide a resin composition having a fixing property in a high temperature region at the time of soldering, and a flux which can be washed by using the resin composition and having a flux residue. The resin composition has a ratio of a hydroxycarboxylic acid having two or more carboxyl groups and a hydroxyl group in the molecule to the thermosetting resin of 1:3 or more and 1:7 or less. In addition, the flux contains 8.5 mass% or more and 16 mass% or less of a hydroxycarboxylic acid having two or more carboxyl groups and a hydroxyl group in the molecule, and a thermosetting resin of 50% by mass or more and 60% by mass or less, and a hydroxyl group. The ratio of the carboxylic acid to the thermosetting resin is 1:7 or less. |
| priorityDate |
2014-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |