http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201627531-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1617 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1646 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate | 2015-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb2fe535222776797d2d374cebd51c5a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_894da4ad11c00c89991840908ea35edf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67f134de69f06da6601473b7fdb80ba1 |
| publicationDate | 2016-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201627531-A |
| titleOfInvention | Palladium electroplating bath composition and electroless plating method |
| abstract | This invention relates to an aqueous plating bath composition and a method of depositing a palladium layer on a substrate by electroless plating. The aqueous plating bath composition of the present invention comprises a palladium ion source, a palladium ion reducing agent, and an aldehyde compound. The aqueous plating bath composition has an increased rate of palladium deposition while maintaining bath stability. The aqueous plating bath composition also has an extended life. The aldehyde compound of the present invention allows the deposition rate to be adjusted to a constant range during the life of the bath and allows electroless deposition of the palladium layer at lower temperatures. The aldehyde compound of the present invention activates an electroless palladium plating bath having a lower deposition rate and reactivates the aged electroless palladium plating bath. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I724225-B |
| priorityDate | 2014-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 167.