http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201626865-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2015-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_685f827b129d947e0237952b061240c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa4ec60f2080d3403672ff26bd80510c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae135272847ed44ca19fafac0ff60147 |
| publicationDate | 2016-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201626865-A |
| titleOfInvention | Shielding film, shielded printed circuit board, and the like |
| abstract | The present invention provides a shielding film and a shielding printed circuit board using the same, which is a shielding film for a printed circuit board provided with a signal circuit, a grounding circuit and a first insulating protective layer on a base insulating substrate, and has: a conductive adhesive layer laminated on the entire surface of the first insulating protective layer, and a copper plating layer patterned on the conductive adhesive layer by a film thickness of 0.5 to 20 μm and an aperture ratio of 40 to 95%, and plating a layer (A-1) formed of a conductive ink on the copper layer, a layer (A-2) formed of a conductive ink inside the opening of the copper plating layer on the conductive adhesive layer, and the conductive layer The adhesive layer, the copper plating layer, the second insulating protective layer on the layer (A-1) and the layer (A-2). The above shielding film has high electromagnetic wave shielding properties and is thin. Further, the shield printed circuit board is excellent in connection reliability with the ground circuit of the printed circuit board, and the degree of freedom in designing the impedance control is high. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112332190-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11284505-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I713845-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022104933-A1 |
| priorityDate | 2014-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 125.