| abstract |
The present invention relates to a composition for cleaning an integrated circuit substrate, the composition comprising: water; an oxidizing agent comprising an ammonium salt of an oxidizing species; and a corrosion inhibitor comprising a primary alkylamine having the following Formula: R'NH2, wherein R' is an alkyl group containing up to about 150 carbon atoms and more usually an aliphatic alkyl group having from about 4 to about 30 carbon atoms; optionally, a water-miscible organic solvent; Ground, an organic acid; optionally, a buffer species; optionally, a fluoride ion source; and optionally, a metal chelating agent. |