| abstract |
The present invention provides a conductive composition capable of forming a joint portion that maintains a thickness of a joint portion and maintains joint strength, and an electronic component using the conductive composition.nThe conductive composition of the present invention comprises (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent, and (C) an endothermic peak of a DSC chart measured by a differential scanning calorimeter. A thermoplastic resin particle having a maximum value in the range of 80 ° C to 170 ° C. (C) Thermoplastic Resin Particles The maximum value of the endothermic peak of the DSC chart measured by a differential scanning calorimeter is preferably in the range of 110 ° C to 140 ° C. |