| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b8112ab8a1825c66d3aee97d461d8eb |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H36-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14 |
| filingDate |
2015-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6e2a487c25a6e80f74a12927ae7e899
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b792249bd178f8a3c887df9d9bb86cc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b68ef696c366cfd38dac63a59ab7f89 |
| publicationDate |
2016-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201620708-A |
| titleOfInvention |
Molded product, electronic component sheet, electronic product, and method of manufacturing the molded article |
| abstract |
A molded article, an electronic component sheet, an electronic product, and a method for producing a molded article, wherein a circuit pattern and a connection pattern formed by thick film printing adhered to a molded body are less likely to be broken. The thick film conductive layer is configured to expose the connection pattern by peeling off the base film in the second wiring range. However, even if the base film is peeled off, the circuit pattern of the thick film conductive layer is sandwiched and fixed between the base film and the adhesive layer in the first wiring range. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114555319-A |
| priorityDate |
2014-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |