| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J129-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-402
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J125-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J135-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2015-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bf89b15da1225640ae32a3b1feefa4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d29f26086ba4589c556af186b1107af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c547fce334bed28d09e3d17666e74b5f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd88cce7193f9976ede48b396403b8aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_579148a77ca1d40280c3fa797b54e924 |
| publicationDate |
2016-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201619315-A |
| titleOfInvention |
Adhesive resin for wafer bonding |
| abstract |
An adhesive bonding method comprising bonding an operational wafer to a front side surface of a device wafer with an adhesive comprising an N-substituted maleimide copolymer. The device wafer can then be thinned from the backside surface of the device wafer while the device wafer is adhesively bonded to the handle wafer. The adhesive is then removed by laser lift-off, wherein the device wafer is separated from the handle wafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I664716-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10475810-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I787242-B |
| priorityDate |
2014-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |