http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201618628-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1152 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2015-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52cca6a9292469f4ccf25facefa11b26 |
| publicationDate | 2016-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201618628-A |
| titleOfInvention | Manufacturing method of connection structure |
| abstract | The present invention provides a method of manufacturing a bonded structure in which the solder resist film can be more protruded than the electrode, and the conductive property can be ensured, and the solder particles can be efficiently disposed between the electrodes, thereby improving the conduction reliability between the electrodes.nThe method for manufacturing a connection structure according to the present invention includes the steps of: disposing a conductive paste on a surface of a first connection member; disposing a second connection member on a surface of the conductive paste; and heating the conductive paste to solder A connection portion is formed at a temperature equal to or higher than a melting point of the particles and a hardening temperature of the thermosetting component, and a solder resist film is used as the first connection member in a region where the first electrode is not provided on the surface of the first electrode side. And the first connection target member having a surface on the outer surface of the solder resist film that protrudes more than the outer surface of the first electrode. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I606565-B |
| priorityDate | 2014-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.