| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_026b10a888a2d30962e2bfb7e8d86868 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49146 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-2039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-16 |
| filingDate |
2013-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b30eeb533200b902db9e7f75fab665a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e5c52d3e29d2e8dff7cc9252d040752 |
| publicationDate |
2016-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201617435-A |
| titleOfInvention |
System, structure and materials for cooling electronic components |
| abstract |
The present invention provides an electronic component having one or more components that generate heat during operation, the electronic component including a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation includes a heat transfer substrate having a surface in thermal communication with a surrounding environment and temperature management in contact with at least a portion of the one or more components of the electronic component and at least a portion of the thermal transfer substrate material. The temperature management material comprises a polymeric phase change material and a thermally conductive filler having a latent heat of at least 5 Joules per gram and a transfer temperature between 0 ° C and 100 ° C. |
| priorityDate |
2012-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |