| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0758
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 |
| filingDate |
2015-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08f5e5a371f8e4222427dc0436cc1918
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee8a5e3c78d91f9fc511fed7ddb5c3db |
| publicationDate |
2016-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201616239-A |
| titleOfInvention |
Photosensitive resin composition, cured film, device including cured film, semiconductor device, and method of manufacturing semiconductor device |
| abstract |
The present invention provides a photosensitive resin composition which can form a high-resolution pattern, obtains a cured film excellent in heat resistance and crack resistance, and can perform alkali development, and provides an impurity region after forming an impurity region in a semiconductor substrate. A method of shortening a step required for removing a cured film of a composition and a method of manufacturing a semiconductor device using the same can be shortened. The photosensitive resin composition of the present invention is characterized in that it is a photosensitive resin composition containing (A) polysiloxane, and the (A) polysiloxane is a polymerization represented by the general formula (1) The oxime, [Chemical Formula 1] □ (X) and (Y) are represented by the general formula (4) to the general formula (6), 7.5 ≦ (X) ≦ 75 (4) 2.5 ≦ (Y) ≦ 40 ( 5) 1.5 × (Y) ≦ (X) ≦ 3 × (Y) (6). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I782755-B |
| priorityDate |
2014-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |