| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_daba41d2788a216f96e2eeb35810840c |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6708
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B33-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B33-10 |
| filingDate |
2015-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9583458ed2f1261eae01c2a34807b3c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_796fa26124a9baceb42575cf5bfe30f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e1878618b785525cfc96fb3e209b98c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_593b03edb413e7eaca4e96d9f640cdd8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ed9133e4709ce8e35c2173c720ddc06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29c33291a6169849a9ba9037e448d45d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35d9f504fc5fd83959aa8adb3a82218e |
| publicationDate |
2016-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201615905-A |
| titleOfInvention |
System and method for performing a wet etching process |
| abstract |
The present invention discloses a system and method for performing a wet etch process. The system includes a plurality of processing stations accessible by a transfer device, the processing stations including a measurement station that optically measures the thickness of a wafer before and after each etching step in the process. The system also includes a controller that analyzes the thickness measurement in view of a target wafer profile and dynamically generates an etch recipe for each of the etching steps. In addition, the process controller can cause a single wafer wet etch station to etch wafers according to the resulting etch recipe. Additionally, the system can generate and/or modify the etch recipe based on the pre-etch and post-etch thickness measurements and the target etch profile. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I681700-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I723235-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10845715-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I769642-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11262662-B2 |
| priorityDate |
2014-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |