| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2015-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37a5f04591174e1740e62ddf0a6902cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_356042ba544fad61e7020f0115fbef70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36f20827466f1630810272903114aef4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40d38e72ff07c0fcf4815c8510b60c75 |
| publicationDate |
2016-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201610231-A |
| titleOfInvention |
Method for electrochemically depositing metal on a reactive metal film (1) |
| abstract |
According to one embodiment of the present invention, there is provided a method for depositing a metal on a reactive metal film on a workpiece, the method comprising: using a plating electrolyte and applying a cathode potential in a range of about -1 V to about -6 V A metallization layer is electrochemically deposited on the seed layer formed on the workpiece, the plating electrolyte having at least one electroplated metal ion and a pH range of from about 6 to about 11. Wherein the workpiece comprises a barrier layer disposed between the seed layer of the workpiece and an electrical media surface, the barrier layer comprising a first metal having a more negative standard electrode potential than 0V And the seed layer comprises a second metal having a standard electrode potential that is more positive than 0V. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I756319-B |
| priorityDate |
2014-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |