| abstract |
A composition for polishing a silicon wafer having excellent haze reduction effect on the surface of a wafer. The composition for polishing a wafer according to the present invention contains abrasive grains, a ruthenium wafer polishing accelerator, a polymer containing a guanamine group, and water. The polymer containing a guanamine group has a constituent unit A derived from a monomer represented by the following formula (1) in the main chain. Further, the average secondary particle diameter of the abrasive grains is 10 nm or more and 60 nm or less.n□ |