| abstract |
The present invention discloses an etchant composition comprising: nitric acid, 3% by weight or more and less than 10% by weight; chloride, 0.01% by weight or more and 5% by weight or less; ammonia compound, 0.1% by weight or more And 5% by weight or less; a cyclic amino compound, 0.1% by weight or more and 5% by weight or less; and the balance by weight of water. Accordingly, etching of a metal layer including copper, titanium, molybdenum or aluminum can be prevented by selectively etching the metal oxide layer. |