| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0444efde206a2f829562761e58b7e1e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60 |
| filingDate |
2015-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50de391f4931ff097c5915083c7b3df5 |
| publicationDate |
2016-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201609949-A |
| titleOfInvention |
Curable resin composition and cured product thereof, substrate for mounting optical semiconductor element, and optical semiconductor device |
| abstract |
An object of the present invention is to provide a curable epoxy resin composition capable of forming a cured product having high reflectance (light reflectivity) and excellent heat resistance.nThe curable epoxy resin composition of the present invention comprises an alicyclic epoxy compound (A), an isocyanurate monoallyl diglycidyl ester compound (B), an inorganic filler (C), and a hardener. (D), and a hardening epoxy resin composition of the hardening accelerator (E), the content of the compound (B) is relative to the total amount of the alicyclic epoxy compound (A) and the compound (B) (100% by weight) The content of the inorganic filler (C) is from 50 to 95% by weight based on the total amount (100% by weight) of the curable epoxy resin composition. |
| priorityDate |
2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |